AMD today announced the next generation in mainstream consumer computing with the availability of the new high-performance AMD Fusion A-Series Accelerated Processing Units (APUs).


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At Computex last week, AMD displayed an IHS that could be a fully functional Bulldozer APU code named 'Trinity'. Details have now emerged that the APU to replace Llano in 2012, could be packing some serious punch with up to 2 billion transistors.

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AMD Continues to Power the Ultimate PC Gaming and Hi-Def Experience with FX Brand and New "Gaming Evolved" Collaborations.


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As Computex nears, a fleet of incoming mainboards supporting AMD's next-gen processors are set to be released. MSI, Have now officially released their 9 series AM3+ motherboards into the fray.

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We really have entered the Mobile Age of Technology, some may argue that mobile technology being touted today has been around for quite a long time, they wouldn't be lying. The truth is, we have only just entered the MAT and things are starting to heat up.

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AMD Fusion technology, named “Best in Show” at Embedded Systems Conference, is available for full-featured, fanless embedded systems in as little as 5.5W

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With Computex 2011 coming very close there is no surprise of the myriad of new boards set to be released from AMD's partners. Most interestingly though is the report of ASRock having an A75 Extreme6, which as it implies is an A75 hudson chipset for Llano.

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AMD may say goodbye to BIOS as they have announced that Llano APUs and following products will support Coreboot. AMD had initally focused on getting support for Coreboot on servers and embedded platforms but have now said that they are committed in supporting Coreboot on ALL future products.

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Next month at Computex AMD and their partners will be revealing a bounty of products that are set to hit the market soon after. Recently confirmed to launch at Computex is the AMD 9xx series AM3+ motherboards and here is a glimpse of the ASUS 990X

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San Jose, Calif.—April 13, 2009—OCZ Technology Group, a worldwide leader in innovative, ultra-high performance and high reliability memory, today expanded their memory lineup for AMD enthusiasts and power users with new DDR3 kits qualified and optimized specifically for the AM3 platform. The new low-voltage kits were designed exclusively for AMD’s transition to DDR3 and are tailored to make full use of the latest computing environments as well as establish a future-proof system with restricted voltage requirements.

“AMD’s new AM3 architecture is designed specifically for the gaming community, with emphasis on high data transfer rates between the system memory and the graphics subsystem,” commented Dr. Michael Schuette, VP of Technology Development at OCZ. “The key improvement over the AM2 platform is the embracing of DDR3 technology where OCZ has a track record of being a market leader. These new AMD kits further establish our leading role in this category and show our commitment to both industry partners and the gaming community by complementing AMD’s gaming platform with future-oriented, low voltage memory technology.”


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